FAQ

Thermal paste is a type of Thermal Interface Material (TIM) commonly used to fill microscopic gaps between two surfaces. In a PC, its most common application is between the CPU and the CPU cooler. The paste’s carrier material, such as silicone oil, contains microscopically small particles like aluminum oxide or zinc oxide, which help transfer heat from the CPU to the cooler.

We refer to our products X-8 and X-10 as “conventional” thermal pastes. These products consist of a carrier material (also called matrix material) such as silicone oil and integrated nanoparticles for heat conduction. These nanoparticles are typically electrically non-conductive oxides, such as aluminum oxide.

Liquid metal is usually a gallium-based Thermal Interface Material (TIM) that often contains other metals like indium. This metal mixture remains liquid at room temperature. Since liquid metal does not contain particles like aluminum oxide, it can be applied in an extremely thin layer between the CPU and the cooler, allowing for excellent heat transfer.

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Polartherm thermal pastes are suitable for normal overclocking.

Thermal paste can be applied directly or using the included spatulas or applicators. You can find more details on the product pages.

The pattern, whether a dot in the center, a cross, or a long line, depends on the size of the heat spreader. For large CPU heat spreaders, it’s best to evenly spread the paste using a spatula.

To remove thermal paste, it is recommended to first clean roughly, for example, using a piece of kitchen paper. Afterward, it should be wiped down with an isopropanol-based cleaner.

The thermal paste should be replaced when temperatures begin to worsen.

Spatula Method: Use the provided spatula to spread the paste over the CPU surface. The cooler compresses the paste, ensuring complete coverage even in the smallest areas.

Applicator Method: Apply the paste directly onto the CPU heat spreader using the included applicator to ensure a thin, even layer. The pressure from the cooler will then fill any remaining gaps.

It is recommended to store the syringe in its packaging in a place protected from direct sunlight (UV radiation).

For the best results, we recommend spreading the paste across the entire surface of the chip. If this is not possible, an X of thermal paste can alternatively be applied to the chip. The pressure will spread the paste adequately. Ensure not to apply too much thermal paste.

Check if the cooler is seated with enough pressure on the CPU/GPU. If temperatures are still too high despite proper installation, the issue may lie with the CPU/GPU itself.

Thermal pastes with lower viscosity are less prone to the pump-out effect. However, this effect occurs with all thermal pastes. Completely immune to the pump-out effect are thermal pads made of materials such as graphene or carbon.