Durable enough To Resist Pump-Out Effect
The pump-out effect occurs when thermal paste is gradually squeezed out between the heat spreader and the CPU cooler’s base plate due to deformation from temperature changes under load. Materials like silicon and copper have different thermal expansion rates, which makes the effect more pronounced, especially with a copper cooler on a graphics chip. At lower temperatures, the pump-out effect is less severe, making X-8, with its low viscosity, ideal for CPUs with lower heat output. Signs that the thermal paste needs replacing include rising CPU temperatures and reduced clock speeds.